Book Details
Orange Code:68167
Paperback:181 pages
Publications:
Categories:
Sections:
1. Introduction: Work Around Moore’s Law2. 3D/TSV-Enabling Technologies3. TSV Modeling and Analysis4. TSV Verification5. TSV Macro-Modeling Framework6. TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications, and TSV-Based Bandpass Filter7. Imperfection in TSV Modeling8. New Trends in TSV9. TSV Fabrication10. Conclusions
Description:
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This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
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